Description
- Material: FR4 (flame retardant epoxy glass reinforced).
- Layer: Single-sided (copper on one side, FR4 substrate on the other).
- Dimensions: 10 cm x 15 cm (or 100mm x 150mm).
- Copper Thickness: Typically 12µm (0.00047 inch) or 35µm (0.0014 inch), but other thicknesses are available.
- Finish: Lead-free HAL (Hot Air Solder Leveling) is a common finish, according to Advanced PCB.
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