Solder Removal (Wick)

3,000ج.س.

تم تصميمه خصيصًا لإزالة اللحامات عالية الحرارة الموجودة اليوم

It is specially designed for removal of today’s high-temperature lead-free solders

Description

  • Engineered specifically for high temperature, lead-free solders
  • Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
  • Specifically designed for all lead-free solders
  • Can also be used with Tin/Lead solders
  • Soder-Wick® Lead-Free packaged in ESD-safe static dissipative bobbins
  • Minimizes the risk of damage associated with static electricity
  • Non-corrosive ultra high purity no-clean flux
  • Will not leave ionic contamination on the boards
  • Especially effective at removing residual solder from SMT pads
  • RoHS Compliant
  • Patent Pending

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